Sr Specialist, Mechanical Engineer (Electronics Packaging)
Company: L3Harris Technologies
Location: Chatsworth
Posted on: October 8, 2024
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Job Description:
Job Title: Senior Specialist, Mechanical Engineer (Electronics
Packaging)
Job Code: 15460
Job Location: Van Nuys, CA
Relocation: Relocation assistance is available for qualified
candidates!
Job Description:
Seeking an Electronic Packaging / Mechanical Engineer to work with
a cross-functional team to develop and integrate Electronic
Packaging systems with ground up designs as well as COTS
components/assemblies, following the product from conceptualization
through hardware integration and testing. The position will require
performing the mechanical engineering activities related to the
design, analysis, documentation, processing, fabrication, assembly
and qualification of product to the specification requirements with
technical, schedule, and process requirements. Provide legacy
design production engineering support to address root cause and
corrective action evaluation and make recommended design updates as
requirements change to ensure the product maintains production
schedule.
Essential Functions:
Support the design and development of complex mechanical,
electronic packaging and electro-mechanical designs and execute
layouts for multiple large scale radar products.
Develop solutions for packaging of electrical components including
COTS components and assemblies, Circuit Cards, Connectors, and
cables, including design, integration and validation in rugged
environments. Responsible for following standard MEP design
practices including relevant internal and program design reviews
prior to the release of the design in the product data management
tool.
Work closely with cross-functional teams including Designers,
Thermal/Structural Analysts, Systems Engineers, as well as other
engineering disciplines as well as Operations, Procurement,
Quality, Program Managers, and customer counterparts in the
development of new designs and releasing to production.
Perform and guide analyses including thermal analysis of large
cooling systems down to the printed circuit assembly level, as well
as fluid, structural (static, vibration and shock), and power.
Responsible for developing, integrating, and validating new designs
including prototyping, testing, and troubleshooting of the new
products as they are released for full scale production. This will
also include the development and implementation of test protocols
for both informal and formal design testing as well as the support
of manufacturing work instruction documentation as needed by the
Production manufacturing engineering team.
Support proposal technical content for bids: scope capture,
requirements development, materials pricing, and labor estimates as
required.
May lead, train, and mentor junior engineers.
Qualifications:
Bachelor's Degree in Mechanical Engineering and minimum 6 years of
prior relevant experience or a Graduate Degree (MS/PhD) and a
minimum of 4 years of prior related experience. In lieu of a
degree, minimum of 12 years of prior related experience.
4+ years experience in solving electronic packaging trades
involving Printed Board assembly (PCB) and Circuit Card Assembly
(CCA) designs under enviromental conditions
Experience with MIL Standards including but not limited to 810, 461
as well as material, plating and electronics packaing assembly MIL
standards
CAD experience utilizing PTC CREO/Windchill
Structural analysis experience in ANSYS
Experience with and understanding of standard ASME Y14.5M-1994 and
GD&T
Ability to obtain and maintain a security clearance
Preferred Additional Skills:
Experience with large radar motor and transmission systems
Experience with integration of COTS components/assemblies in a lead
system integrator role
Experience with machined, plastic and sheet metal part design
Design for Manufacturability and Assembly (DFM/DFMA) experience
Experience with PDM
Experience with Earned Value Management cost and schedule
practices
Experience with Project Management A wide degree of creativity and
latitude is expected, including the ability to multi-task in an
environment with changing priorities
Proficiency in MS Office suite
Effectively communicate issues/problems and results that impact
timelines, accuracy, and reliability of project data
In compliance with pay transparency requirements, the salary range
for this role is $97,500.00 - $181,500.00. This is not a guarantee
of compensation or salary, as final offer amount may vary based on
factors including but not limited to experience and geographic
location. L3Harris also offers a variety of benefits, including
health and disability insurance, 401(k) match, flexible spending
accounts, EAP, education assistance, parental leave, paid time off,
and company-paid holidays. The specific programs and options
available to an employee may vary depending on date of hire,
schedule type, and the applicability of collective bargaining
agreements.
Keywords: L3Harris Technologies, Burbank , Sr Specialist, Mechanical Engineer (Electronics Packaging), Engineering , Chatsworth, California
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